Integrity of copper-tantalum nitride metallization under different ambient conditions

10.1149/1.1393526

Saved in:

Bibliographic Details
Main Authors:	Yap, K.P., Gong, H., Dai, J.Y., Osipowicz, T., Chan, L.H., Lahiri, S.K.
Other Authors:	PHYSICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/96947
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Description
Summary:	10.1149/1.1393526

Similar Items