Integrity of copper-tantalum nitride metallization under different ambient conditions
10.1149/1.1393526
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sg-nus-scholar.10635-969472023-10-31T08:02:05Z Integrity of copper-tantalum nitride metallization under different ambient conditions Yap, K.P. Gong, H. Dai, J.Y. Osipowicz, T. Chan, L.H. Lahiri, S.K. PHYSICS MATERIALS SCIENCE 10.1149/1.1393526 Journal of the Electrochemical Society 147 6 2312-2318 JESOA 2014-10-16T09:29:29Z 2014-10-16T09:29:29Z 2000-06 Article Yap, K.P., Gong, H., Dai, J.Y., Osipowicz, T., Chan, L.H., Lahiri, S.K. (2000-06). Integrity of copper-tantalum nitride metallization under different ambient conditions. Journal of the Electrochemical Society 147 (6) : 2312-2318. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1393526 00134651 http://scholarbank.nus.edu.sg/handle/10635/96947 000087561800050 Scopus |
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PHYSICS Yap, K.P. Gong, H. Dai, J.Y. Osipowicz, T. Chan, L.H. Lahiri, S.K. |
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Yap, K.P. Gong, H. Dai, J.Y. Osipowicz, T. Chan, L.H. Lahiri, S.K. |
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Yap, K.P. Gong, H. Dai, J.Y. Osipowicz, T. Chan, L.H. Lahiri, S.K. Integrity of copper-tantalum nitride metallization under different ambient conditions |
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Yap, K.P. |
title |
Integrity of copper-tantalum nitride metallization under different ambient conditions |
title_short |
Integrity of copper-tantalum nitride metallization under different ambient conditions |
title_full |
Integrity of copper-tantalum nitride metallization under different ambient conditions |
title_fullStr |
Integrity of copper-tantalum nitride metallization under different ambient conditions |
title_full_unstemmed |
Integrity of copper-tantalum nitride metallization under different ambient conditions |
title_sort |
integrity of copper-tantalum nitride metallization under different ambient conditions |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/96947 |
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