Integrity of copper-tantalum nitride metallization under different ambient conditions

10.1149/1.1393526

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Main Authors: Yap, K.P., Gong, H., Dai, J.Y., Osipowicz, T., Chan, L.H., Lahiri, S.K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/96947
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-969472023-10-31T08:02:05Z Integrity of copper-tantalum nitride metallization under different ambient conditions Yap, K.P. Gong, H. Dai, J.Y. Osipowicz, T. Chan, L.H. Lahiri, S.K. PHYSICS MATERIALS SCIENCE 10.1149/1.1393526 Journal of the Electrochemical Society 147 6 2312-2318 JESOA 2014-10-16T09:29:29Z 2014-10-16T09:29:29Z 2000-06 Article Yap, K.P., Gong, H., Dai, J.Y., Osipowicz, T., Chan, L.H., Lahiri, S.K. (2000-06). Integrity of copper-tantalum nitride metallization under different ambient conditions. Journal of the Electrochemical Society 147 (6) : 2312-2318. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1393526 00134651 http://scholarbank.nus.edu.sg/handle/10635/96947 000087561800050 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1149/1.1393526
author2 PHYSICS
author_facet PHYSICS
Yap, K.P.
Gong, H.
Dai, J.Y.
Osipowicz, T.
Chan, L.H.
Lahiri, S.K.
format Article
author Yap, K.P.
Gong, H.
Dai, J.Y.
Osipowicz, T.
Chan, L.H.
Lahiri, S.K.
spellingShingle Yap, K.P.
Gong, H.
Dai, J.Y.
Osipowicz, T.
Chan, L.H.
Lahiri, S.K.
Integrity of copper-tantalum nitride metallization under different ambient conditions
author_sort Yap, K.P.
title Integrity of copper-tantalum nitride metallization under different ambient conditions
title_short Integrity of copper-tantalum nitride metallization under different ambient conditions
title_full Integrity of copper-tantalum nitride metallization under different ambient conditions
title_fullStr Integrity of copper-tantalum nitride metallization under different ambient conditions
title_full_unstemmed Integrity of copper-tantalum nitride metallization under different ambient conditions
title_sort integrity of copper-tantalum nitride metallization under different ambient conditions
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/96947
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