Integrity of copper-tantalum nitride metallization under different ambient conditions

10.1149/1.1393526

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Bibliographic Details
Main Authors:	Yap, K.P., Gong, H., Dai, J.Y., Osipowicz, T., Chan, L.H., Lahiri, S.K.
Other Authors:	PHYSICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/96947
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Institution:	National University of Singapore

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