Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

Materials Research Society Symposium - Proceedings

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Bibliographic Details
Main Authors: Zhao, F.F., Shen, Z.X., Zheng, J.Z., Gao, W.Z., Osipowicz, T., Pang, C.H., Lee, P.S., See, A.K.
Other Authors: PHYSICS
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/98936
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/98936

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