Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

Materials Research Society Symposium - Proceedings

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Bibliographic Details
Main Authors:	Zhao, F.F., Shen, Z.X., Zheng, J.Z., Gao, W.Z., Osipowicz, T., Pang, C.H., Lee, P.S., See, A.K.
Other Authors:	PHYSICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/98936
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-98936
record_format	dspace
spelling	sg-nus-scholar.10635-989362015-02-21T19:55:26Z Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS Zhao, F.F. Shen, Z.X. Zheng, J.Z. Gao, W.Z. Osipowicz, T. Pang, C.H. Lee, P.S. See, A.K. PHYSICS Materials Research Society Symposium - Proceedings 716 41-46 MRSPD 2014-10-16T09:53:14Z 2014-10-16T09:53:14Z 2002 Conference Paper Zhao, F.F.,Shen, Z.X.,Zheng, J.Z.,Gao, W.Z.,Osipowicz, T.,Pang, C.H.,Lee, P.S.,See, A.K. (2002). Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS. Materials Research Society Symposium - Proceedings 716 : 41-46. ScholarBank@NUS Repository. 02729172 http://scholarbank.nus.edu.sg/handle/10635/98936 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Materials Research Society Symposium - Proceedings
author2	PHYSICS
author_facet	PHYSICS Zhao, F.F. Shen, Z.X. Zheng, J.Z. Gao, W.Z. Osipowicz, T. Pang, C.H. Lee, P.S. See, A.K.
format	Conference or Workshop Item
author	Zhao, F.F. Shen, Z.X. Zheng, J.Z. Gao, W.Z. Osipowicz, T. Pang, C.H. Lee, P.S. See, A.K.
spellingShingle	Zhao, F.F. Shen, Z.X. Zheng, J.Z. Gao, W.Z. Osipowicz, T. Pang, C.H. Lee, P.S. See, A.K. Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
author_sort	Zhao, F.F.
title	Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
title_short	Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
title_full	Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
title_fullStr	Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
title_full_unstemmed	Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
title_sort	thickness effect on nickel silicide formation and thermal stability for ultra shallow junction cmos
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/98936
_version_	1681092115117899776

Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

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