Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS
Materials Research Society Symposium - Proceedings
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Main Authors: | Zhao, F.F., Shen, Z.X., Zheng, J.Z., Gao, W.Z., Osipowicz, T., Pang, C.H., Lee, P.S., See, A.K. |
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Other Authors: | PHYSICS |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/98936 |
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Institution: | National University of Singapore |
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