Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

Materials Research Society Symposium - Proceedings

Saved in:
Bibliographic Details
Main Authors: Zhao, F.F., Shen, Z.X., Zheng, J.Z., Gao, W.Z., Osipowicz, T., Pang, C.H., Lee, P.S., See, A.K.
Other Authors: PHYSICS
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/98936
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:Materials Research Society Symposium - Proceedings

Similar Items