Thickness effect on nickel silicide formation and thermal stability for ultra shallow junction CMOS

• Main Authors: Zhao, F.F., Shen, Z.X., Zheng, J.Z., Gao, W.Z., Osipowicz, T., Pang, C.H., Lee, P.S., See, A.K.
• Other Authors: PHYSICS
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/98936
• Institution: National University of Singapore

Materials Research Society Symposium - Proceedings