An innovative backside focused ion beam application for microelectronic devices failure analysis

Electrical and physical failure analysis is a key operation in the expanding and dynamic world of semiconductor product design and manufacturing. It has been known to contribute significantly to the enhancement of performance and reliability of a product, by giving valuable feedback to designers and...

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Bibliographic Details
Main Author: Endrinal, Lesly Zaren V.
Format: text
Language:English
Published: Animo Repository 2009
Online Access:https://animorepository.dlsu.edu.ph/etd_masteral/3790
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Institution: De La Salle University
Language: English

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