A new creep model for SnAgCu lead-free composite solders : incorporating back stress

• المؤلفون الرئيسيون: Nai, S. M. L., Xu, L. Y., Zhang, S. R., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/103336; http://hdl.handle.net/10220/6383

The paper presents improved constitutive models for SnAgCu solder. In the present study, the constitutive behavior for creep performance of 95.8Sn-3.5Ag-0.7Cu lead-free solder was investigated. The secondary creep stage was focused on. It is shown that the stress exponent n can be well-defined into...