Void density investigation of low temperature InP (chip) /Al2O3/Si (wafer) direct bonding

• Main Author: Shang, Ling Ru
• Other Authors: Tang Xiao Hong
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/64062
• Institution: Nanyang Technological University

Silicon photonics has attracted extensive research attention due to its advantages of lower single delay and power consumption, higher level of integration and, as a consequence, more diversifiedfunctionalities. However, InP on Si direct wafer bonding, as one of the promising approach to achieve III...