Fracture toughness assessment of a solder joint using double cantilever beam specimens

• Main Authors: Lee, Adeline Puay Chen, Lim, Zan Xuan, Yantara, Natalia, Loo, Shane Zhi Yuan, Tee, Tong Yan, Tan, Cher Ming, Chen, Zhong
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2010
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials; DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/91518; http://hdl.handle.net/10220/6384
• Institution: Nanyang Technological University

Conventional assessment of solder joint reliability uses either ball shear test or solder ball pull test. The test results are reported in terms of materials strength in either shear or tensile mode, and the strength values are size-dependent. Therefore these test results are largely useful only for...