Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects

Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects

This paper presents a fast and accurate steady state thermal simulator for heatsink and microfluid-cooled 3D-ICs. This model considers the thermal effect of TSVs at fine-granularity by calculating the anisotropic equivalent thermal conductances of a solid grid cell if TSVs are inserted. Entrance eff...

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書目詳細資料
Main Authors:	Chip-Hong Chang, Wei Zhang, Hao Yu, Qian, Hanhua, Liang, Hao
其他作者:	School of Computer Engineering
格式:	Conference or Workshop Item
語言:	English
出版:	2013
主題:	DRNTU::Engineering::Electrical and electronic engineering
在線閱讀:	https://hdl.handle.net/10356/98133 http://hdl.handle.net/10220/17974
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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