The manufacture and performance of diodes made in dielectrically isolated silicon substrates containing buried metallic layers
Results are reported on the performance of diffused p+n diode structures manufactured on a novel silicon-on-metalon-insulator (SMI) substrate. This substrate consists of a thin single crystal silicon layer on top of a tungsten disilicide covered oxidized silicon wafer. The diodes show excellent char...
Saved in:
Main Authors: | Goh, Wang Ling, Raza, S. H., Montgomery, J. H., Armstrong, B. M., Gamble, H. S. |
---|---|
Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/99895 http://hdl.handle.net/10220/5989 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Electrical characterization of dielectrically isolated silicon substrates containing buried metallic layers
by: Goh, Wang Ling, et al.
Published: (2009) -
Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects
by: Sharma, G., et al.
Published: (2014) -
The effect of interfacial layer of high-K dielectrics on GaAs substrate
by: Tong, Y., et al.
Published: (2014) -
Schottky diodes fabricated on cracked GaN epitaxial layer grown on (111) silicon
by: Park, S.-J., et al.
Published: (2014) -
Impact of buried capping layer on TDDB physics of advanced interconnects
by: Yiang, K.Y., et al.
Published: (2014)