Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear

10.1016/j.wear.2006.11.030

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書目詳細資料
Main Authors:	Cai, M.B., Li, X.P., Rahman, M.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Dynamic hard particles Groove wear Molecular dynamics Nanoscale cutting Silicon
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/59684
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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