Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples

Fractal analysis of intermetallic compounds in Sn-Ag, Sn-Ag-Bi, and Sn-Ag-Cu diffusion couples

10.1016/j.matlet.2005.10.090

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Bibliographic Details
Main Authors: Jayaganthan, R., Mohankumar, K., Sekhar, V.N., Tay, A.A.O., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Fractal dimension
Intermetallic compounds
Pb-Free solders
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60362
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Institution: National University of Singapore

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