Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder

10.1115/IMECE2008-66904

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Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85940
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Institution: National University of Singapore

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