Effect of nano-size oxide based reinforcement on the tensile properties of Sn-Ag-Cu solder
10.1115/IMECE2008-66904
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Main Authors: | Nai, S.M.L., Wei, J., Gupta, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85940 |
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Institution: | National University of Singapore |
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