Influence of reinforcements on the electrical resistivity of novel Sn-Ag-Cu composite solder

Influence of reinforcements on the electrical resistivity of novel Sn-Ag-Cu composite solder

10.1115/IMECE2007-41762

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書目詳細資料
Main Authors:	Nai, S.M.L., Wei, J., Gupta, M.
其他作者:	MECHANICAL ENGINEERING
格式:	Conference or Workshop Item
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/85995
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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