Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2

10.1016/S0921-5107(99)00517-6

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Main Authors:	Lee, Y.K., Maung Latt, K., Jaehyung, K., Osipowicz, T., Lee, K.
Other Authors:	PHYSICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/98084
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-980842023-10-29T22:23:07Z Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2 Lee, Y.K. Maung Latt, K. Jaehyung, K. Osipowicz, T. Lee, K. PHYSICS 10.1016/S0921-5107(99)00517-6 Materials Science and Engineering B: Solid-State Materials for Advanced Technology 68 2 99-103 MSBTE 2014-10-16T09:42:47Z 2014-10-16T09:42:47Z 1999-12-27 Article Lee, Y.K., Maung Latt, K., Jaehyung, K., Osipowicz, T., Lee, K. (1999-12-27). Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 68 (2) : 99-103. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(99)00517-6 09215107 http://scholarbank.nus.edu.sg/handle/10635/98084 000084865500008 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/S0921-5107(99)00517-6
author2	PHYSICS
author_facet	PHYSICS Lee, Y.K. Maung Latt, K. Jaehyung, K. Osipowicz, T. Lee, K.
format	Article
author	Lee, Y.K. Maung Latt, K. Jaehyung, K. Osipowicz, T. Lee, K.
spellingShingle	Lee, Y.K. Maung Latt, K. Jaehyung, K. Osipowicz, T. Lee, K. Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
author_sort	Lee, Y.K.
title	Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
title_short	Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
title_full	Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
title_fullStr	Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
title_full_unstemmed	Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
title_sort	study of diffusion barrier properties of ionized metal plasma (imp) deposited tantalum (ta) between cu and sio2
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/98084
_version_	1781786803621068800

Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2

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