Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
10.1016/S0921-5107(99)00517-6
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Main Authors: | Lee, Y.K., Maung Latt, K., Jaehyung, K., Osipowicz, T., Lee, K. |
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Other Authors: | PHYSICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/98084 |
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Institution: | National University of Singapore |
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