Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2

10.1016/S0921-5107(99)00517-6

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Bibliographic Details
Main Authors: Lee, Y.K., Maung Latt, K., Jaehyung, K., Osipowicz, T., Lee, K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/98084
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Institution: National University of Singapore
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