Study of diffusion barrier properties of ionized metal plasma (IMP) deposited tantalum (Ta) between Cu and SiO2
10.1016/S0921-5107(99)00517-6
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Main Authors: | , , , , |
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Other Authors: | |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/98084 |
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Institution: | National University of Singapore |
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