Solder splash control through seal profile optimization and material loading management
A low yield of 99.6% was experienced in the A2 Seal process in ww39, 1996. Solder splash, occurring at 0.3% was the main defect at this time when 4708 ceramic packages were introduced. To confront this challenge, the seal yield recovery task force was formed to bring yields to the 99.85% target and...
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| Format: | text |
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Animo Repository
1996
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| Online Access: | https://animorepository.dlsu.edu.ph/faculty_research/13344 |
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| Institution: | De La Salle University |