Development of InSbN alloys for 8 to 12 micron room temperature infrared photodetectors
Indium antimonide (InSb) has the smallest energy gap in the binary III-V materials, with a cut off wavelength of 7 μm at 300 K. The introduction of nitrogen into InSb causes a phenomenon of a strong negative band gap bowing effect, leading to the extended response wavelength of 8 μm to 12 μm rang...
Saved in:
Main Author: | Zhang, Dao Hua |
---|---|
Other Authors: | School of Electrical and Electronic Engineering |
Format: | Research Report |
Language: | English |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/14521 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
by: Goh, Hua Kooi.
Published: (2008) -
Study of VIA etching for sub-micron device fabrication
by: Ho, Chiew Nyuk.
Published: (2008) -
Evaluation of process requirements for room temperature direct copper bonding
by: Chen, Qiang.
Published: (2009) -
Electroplating of copper metallization of sub-micron integrated circuits
by: Law, Shao Beng.
Published: (2008) -
Half-Heusler based multicomponent alloys for high temperature thermoelectric applications
by: Mishra, Soumya Ranjan
Published: (2023)