Development of carbon nanotubes for interconnects and nano-packaging applications

Development of carbon nanotubes for interconnects and nano-packaging applications

As the scaling in CMOS technology is nearing its limits, the new scaling trend emphasize on making chips smaller, with higher performance and more functionality. This is putting a huge demand on the backend packaging modules, and the industries are now looking at the various challenges faced at the...

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書目詳細資料
主要作者:	Yap, Ray Chin Chong
其他作者:	Tay Beng Kang
格式:	Theses and Dissertations
語言:	English
出版:	2014
主題:	DRNTU::Engineering
在線閱讀:	http://hdl.handle.net/10356/61597
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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