Intrinsic stress in electroless nickel plating and its effect on reliability
Until today electroless nickel (EN) platers rely on their experience to control the quality of their products and the experience usually apply to individual's particular products only. Also the requirements from wide range of industries are so diverse that emphasis is often placed on very diffe...
Saved in:
Main Authors: | Chen, Zhong., Yip, Tick Hon. |
---|---|
Other Authors: | Chen, Zhong |
Format: | Research Report |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/6780 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Effect of plating parameters on the intrinsic stress in electroless nickel plating
by: Chen, Zhong, et al.
Published: (2012) -
Electrolessly-plated ternary nickel alloys as metallization materials for lead-free soldering
by: Yang, Ying
Published: (2014) -
Study of the interfaces between electroless nickel under bump metallization and lead-free solders
by: He, Min.
Published: (2008) -
Effect of carbon nanotubes and their dispersion on electroless Ni–P under bump metallization for lead-free solder interconnection
by: Hu, Xiao, et al.
Published: (2014) -
Contact-displacement PD deposition for electroless copper application
by: Lau, Ping Ping
Published: (2009)