Electroless copper deposition as a seed layer on TiSiN barrier
Electroless deposition of copper as a seeding technology has received considerable attention in back-end-of-line device fabrication. This work explores the effects of plasma processing parameters such as argon gas flow rate and nitrogen plasma treatment time on the properties of electrolessly plated...
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Main Authors: | Chen, Z., Xu, S., Chan, L., See, K. H., Law, S. B., Ee, Elden Yong Chiang |
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Other Authors: | School of Materials Science & Engineering |
Format: | Article |
Language: | English |
Published: |
2012
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/95010 http://hdl.handle.net/10220/7704 |
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Institution: | Nanyang Technological University |
Language: | English |
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