Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

• المؤلفون الرئيسيون: Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/97817; http://hdl.handle.net/10220/18102

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperat...