Structural analysis of breakdown in ultrathin gate dielectrics using transmission electron microscopy

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

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書目詳細資料
Main Authors: Pey, K.L., Tung, C.H., Tang, L.J., Ranjan, R., Radhakrishnan, M.K., Lin, W.H., Lombardo, S., Palumbo, F.
其他作者: INSTITUTE OF MICROELECTRONICS
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/112981
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機構: National University of Singapore