Impact of buried capping layer on electrical stablity of advanced interconnects

10.1116/1.1978895

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Bibliographic Details
Main Authors: Yiang, K.Y., Yoo, W.J., Krishnamoorthy, A.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/56261
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Institution: National University of Singapore

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