A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

10.1007/s00170-005-0364-7

Saved in:

書目詳細資料
Main Authors:	Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Diamond tool Ductile cutting Edge radius Silicon wafer
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/59285
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

相似書籍

The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer
由: Arefin, S., et al.
出版: (2014)

Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon
由: Arefin, S., et al.
出版: (2014)

Effect of cutting edge radius in ductile mode cutting of brittle materials
由: SHAMSUL AREFIN
出版: (2010)

The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
由: Arefin, S., et al.
出版: (2014)

Nano-precision measurement of diamond tool edge radius for wafer fabrication
由: Li, X.P., et al.
出版: (2014)

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
由: Li, X.P., et al.
出版: (2014)

Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon
由: Cai, M.B., et al.
出版: (2014)

Study of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation
由: CAI MINBO
出版: (2010)

Performance of single crystal diamond tools in ductile mode cutting of silicon
由: Uddin, M.S., et al.
出版: (2014)

Effect of crystallographic orientation on wear of diamond tools in nanoscale ductile cutting of silicon
由: MOHAMMAD SHARIF UDDIN
出版: (2010)

Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon
由: Li, X.P., et al.
出版: (2014)

Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon
由: Uddin, M.S., et al.
出版: (2014)

Nanometer scale ductile mode cutting of soda-lime glass
由: Liu, K., et al.
出版: (2014)

Nanometer-scale, ductile-mode cutting of soda-lime glass
由: Liu, K., et al.
出版: (2014)

Modeling of the effect of tool edge radius on surface generation in elliptical vibration cutting
由: Zhang, X., et al.
出版: (2014)

Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
由: Li, X., et al.
出版: (2014)

CBN tool wear in ductile cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)

Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation
由: Cai, M.B., et al.
出版: (2014)

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
由: Cai, M.B., et al.
出版: (2014)

Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon
由: Cai, M.B., et al.
出版: (2014)

Influence of cutting edge radius on small scale material removal at ultra-precise level
由: Rahman, M.A., et al.
出版: (2021)

Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
由: HE TAO
出版: (2010)

A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries
由: Arif, M., et al.
出版: (2014)

Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
由: Cai, M.B., et al.
出版: (2014)

A study on the effect of tool-edge radius on critical machining characteristics in ultra-precision milling of tungsten carbide
由: Arif, M., et al.
出版: (2014)

A study on the effect of tool nose radius in ultrasonic elliptical vibration cutting of tungsten carbide
由: Nath, C., et al.
出版: (2014)

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
由: Cai, M.B., et al.
出版: (2014)

The effect of tool edge radius on the contact phenomenon of tool-based micromachining
由: Woon, K.S., et al.
出版: (2014)

Characteristics of ultrasonic vibration-assisted ductile mode cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)

Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance
由: Liu, K., et al.
出版: (2014)

Effect of cutting edge radius on ductile-brittle transition in cutting of silicon-wafers
由: Li, X.P., et al.
出版: (2014)

Investigations of tool edge radius effect in micromachining: A FEM simulation approach
由: Woon, K.S., et al.
出版: (2014)

The effect of tool edge radius on the chip formation behavior of tool-based micromachining
由: Woon, K.S., et al.
出版: (2014)

Nanometer-scale ductile cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)

A review on the current research trends in ductile regime machining
由: Neo, W.K., et al.
出版: (2014)

Critical undeformed chip thickness and cutting pressure in relation to ductile mode cutting of KDP crystal
由: Chen, H., et al.
出版: (2014)

Ultra-precision turning of electroless-nickel: Effect of phosphorus contents, depth-of-cut and rake angle
由: Pramanik, A., et al.
出版: (2014)

A study on critical depth of cuts in micro grooving
由: Son, S.-M., et al.
出版: (2014)

Extrusion-like chip formation mechanism and its role in suppressing void nucleation
由: Woon, K.S., et al.
出版: (2014)

Ductile cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)