Defect engineering for ultrashallow junctions using surfaces

Defect engineering for ultrashallow junctions using surfaces

10.1149/1.2911485

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Bibliographic Details
Main Authors: Seebauer, E.G., Kwok, C.T.M., Vaidyanathan, R., Kondratenko, Y.V., Yeong, S.H., Srinivasan, M.P., Colombeau, B., Chan, L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74535
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Institution: National University of Singapore

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