Au-In-based hermetic sealing for MEMS packaging for down-hole application

• Main Authors: Vivek, Chidambaram, Chen, Bangtao, Gan, Chee Lip, Daniel, Rhee Min Woo
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2014
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/102827; http://hdl.handle.net/10220/24291
• Institution: Nanyang Technological University

Hermetic sealing of micro-electro mechanical systems (MEMS) sensors for down-hole application requires high-quality void-free bonds, with metallic hermetic sealing being widely used for this purpose. As most of the MEMS sensors cannot withstand high temperatures, transient liquid phase (TLP) bonding...