Vibration and thermal cycling effects on solder joint reliability
This report describes vibration and thermal cycling effects on solder joint reliability, especially its relationship concerning the life prediction of solder joints. It highlights critical parameters needed to support a better understanding of solder joint reliability arising from failure mechanisms...
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| 主要作者: | |
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| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
2014
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/60912 |
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| 機構: | Nanyang Technological University |
| 語言: | English |