Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn–3.8Ag–0.7Cu solder joints

• Main Authors: Che, Faxing, Pang, John Hock Lye
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/96840; http://hdl.handle.net/10220/11610
• Institution: Nanyang Technological University

Intermetallic compound (IMC) growth was investigated under isothermal aging condition at 125 °C for up to 500 h. The evolution in the IMC morphology and microstructure were observed at four aging time conditions for 0, 120, 260 and 500 h, respectively. Solid state IMC growth thickness measurements w...