Novel acoustic techniques for microelectronic failure analysis and characterization
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Saved in:
Main Authors: | Wong, W.K., Street, A.G. |
---|---|
Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/71170 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Failure analysis and characterization for microelectronic packaging
by: Lin, Pamela
Published: (2017) -
A review of laser induced techniques for microelectronic failure analysis
by: Phang, J.C.H., et al.
Published: (2014) -
Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation
by: Wong, W.K., et al.
Published: (2014) -
Scanning Electron Acoustic Microscopy: A Novel Tool for Failure Analysis & Microcharacterisation
by: Wong, W.K., et al.
Published: (2014) -
Single contact beam induced current phenomenon for microelectronic failure analysis
by: Phang, J.C.H., et al.
Published: (2014)