Evaluation of rapid thermal nitrided ONO interpoly dielectric resistance to plasma process-induced damage
International Symposium on Plasma Process-Induced Damage, P2ID, Proceedings
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Main Authors: | Cha, C.L., Chor, E.F., Gong, H., Zhang, A.Q., Dong, Z., Chan, L. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/80402 |
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Institution: | National University of Singapore |
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