Effect of type of reinforcement at nanolength scale on the tensile properties of Sn-0.7Cu solder alloy
10.1109/EPTC.2008.4763510
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Main Authors: | Zhong, X.L., Gupta, M. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85946 |
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Institution: | National University of Singapore |
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