Time evolution study of Ar/N₂ plasma-activated Cu surface for Cu-Cu direct bonding in a non-vacuum environment
In this paper, a two-step copper-copper direct bonding process in a non-vacuum environment is reported. Time-dependent evolution of argon/nitrogen plasma-activated copper surface is carefully studied. A multitude of surface characterizations are performed to investigate the evolution of the copper s...
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| Main Authors: | , , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/153397 |
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| Institution: | Nanyang Technological University |
| Language: | English |