Post stress reliability in submicron MOSFET devices

In this project, we have conducted a systematic investigation of post-breakdown conduction and its instability in ultrathin SiO2 films as well as various studies of interface degradation, charge trapping and oxide barrier height change in deep submicron MOS devices with ultrathin gate oxide caused b...

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Bibliographic Details
Main Authors: Chen, Tupei., Tse, Man Siu.
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/2834
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Institution: Nanyang Technological University

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