Characterisation and modeling of chemical mechanical planarization (CMP) for deep submicron integrated circuit (IC) fabrication

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Bibliographic Details
Main Author: Wang, Sim Kit
Other Authors: David Lee Butler
Format: Theses and Dissertations
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/36109
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Institution: Nanyang Technological University

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