Development of a failure assessment methodology for flip chip electronic assembly

Development of a failure assessment methodology for flip chip electronic assembly

In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb solder and lead-free 96.5Sn/3.5Ag solder. Their solder joint fatigue lives on flip chip on board (FCOB) assembly are assessed by experimental testing and numerical modeling. FCOB assemblies are subjecte...

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書目詳細資料
主要作者:	Yeo, Alfred Swain Hong.
其他作者:	Pang, John Hock Lye
格式:	Theses and Dissertations
出版:	2008
主題:	DRNTU::Engineering::Manufacturing
在線閱讀:	http://hdl.handle.net/10356/5476
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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