Plasma etching optimization of oxide/nitride/oxide interpoly dielectric breakdown time in flash memory devices
10.1109/66.857949
Saved in:
Main Authors: | Cha, C.L., Chor, E.F., Gong, H., Zhang, A.Q., Chan, L. |
---|---|
其他作者: | ELECTRICAL ENGINEERING |
格式: | Article |
出版: |
2014
|
主題: | |
在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/80991 |
標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
機構: | National University of Singapore |
相似書籍
-
Multi-layer high-κ interpoly dielectric for floating gate flash memory devices
由: Zhang, L., et al.
出版: (2014) -
Constant current-stress induced breakdown of reoxidized nitrided oxide (ONO) in Flash memory devices
由: Cha, C.L., et al.
出版: (2014) -
Effects of surface smoothness and deposition temperature of floating gates in flash memory devices to oxide/nitride/oxide interpoly dielectric breakdown
由: Cha, C.L., et al.
出版: (2014) -
Gate Dielectric-Breakdown-Induced Microstructural Damage in MOSFETs
由: Tang, L.J., et al.
出版: (2014) -
GATE DIELECTRIC BREAKDOWN - 2D MODELING OF THE DBIE IMPACT ON THE DEVICE CHARACTERISTICS
由: CAO YU
出版: (2019)