Solder joints morphology study on stacked die

Solder joints morphology study on stacked die

The shift from two dimensional (2D) technology to 3D packaging technology is seen as the only way to incorporate high performance into device miniaturization. Solder joint morphology has become the main reliability concern in the 3D interconnect system which is complicated by the implementation of 3...

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書目詳細資料
主要作者:	Lee, Yi Xuan.
其他作者:	Gan Chee Lip
格式:	Final Year Project
語言:	English
出版:	2011
主題:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
在線閱讀:	http://hdl.handle.net/10356/44253
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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