Effect of electromigration on interfacial reactions between electroless Ni-P and Sn–3.5% Ag solder

• المؤلفون الرئيسيون: Kumar, A., Teo, P. S., He, Min, Chen, Zhong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94742; http://hdl.handle.net/10220/8154

Effect of electromigration on interfacial reactions between electroless Ni–P (EL-Ni) and eutectic Sn–3.5% Ag solder has been investigated. Sandwich-type reaction couples, Cu/EL-Ni/Sn–3.5% Ag/EL-Ni/Cu, having two EL-Ni/Sn–3.5% Ag interfaces were prepared with the help of reflow process. During reflow...