CHARACTERIZATION OF A LOW DIELECTRIC CONSTANT MATERIAL FOR MULTILEVEL INTERCONNECTS

CHARACTERIZATION OF A LOW DIELECTRIC CONSTANT MATERIAL FOR MULTILEVEL INTERCONNECTS

Master's

Saved in:

Bibliographic Details
Main Author:	WANG CUIYANG
Other Authors:	DEPT OF PHYSICS
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/160406
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Similar Items

CHARACTERIZATION OF A LOW DIELECTRIC CONSTANT MATERIAL FOR MULTILEVEL INTERCONNECTS
by: WANG CUIYANG
Published: (2019)

Low dielectric constant materials for multilevel interconnect applications
by: Wong, Terence Kin Shun.
Published: (2008)

High-temperature properties of a low dielectric constant organic spin-on glass for multilevel interconnects
by: Wang, C.Y., et al.
Published: (2014)

Growth and characterization of low-k dielectrics for multilevel interconnect applications
by: Wang, Minrui
Published: (2008)

Study and characterization of low dielectric constant materials for interlayer dielectric applications
by: Narayanan, Babu
Published: (2008)

Characterization of flourosilicate glass (FSG) as low dielectric constant material
by: Teh, Young Way.
Published: (2008)

Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects
by: Liu, Bo
Published: (2008)

Characterization of Cu/Ta/ultra low-k porous polymer structures for multilevel interconnects
by: Yang, L.Y., et al.
Published: (2014)

Fabrication and characterization of mesoporous dielectric materials for ULSI interconnect applications
by: Yu, Suzhu
Published: (2008)

Development and characterization of low dielectric constant polymers for microelectronic applications
by: Feng, Junluo
Published: (2008)

Analysis of mesoporous ultra low K dielectric materials for microelectronic interconnects
by: Goh, Tat Kean.
Published: (2008)

Wire bond process development for low K (dielectric constant) materials
by: Tan, Jonathan Yang Kern.
Published: (2008)

Effect of thermal treatment on carbon-doped silicon oxide low dielectric constant materials
by: Xie, J.L., et al.
Published: (2014)

Study of TMCTS based PECVD carbon-doped low dielectric constant material
by: XIE JIELIN
Published: (2010)

Dielectric reliability of copper/low-k interconnects
by: YIANG KOK YONG
Published: (2010)

Thin dielectric films with low dielectric constants for quarter micron devices
by: Chua, Chee Tee.
Published: (2009)

Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure
by: Lam, Jeffrey C. K., et al.
Published: (2013)

Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
by: Wang, G., et al.
Published: (2014)

Thermal stability of Cu/Ta/ultra low k porous polymer structures for multilevel interconnects
by: Zhang, D.H., et al.
Published: (2014)

STUDY OF PROCESS IMPACT ON K VALUE OF LOW K DIELECTRIC MATERIAL USED IN CU / LOW K DUAL DAMASCENE INTERCONNECT
by: WONG KAH LEONG
Published: (2019)

Ab initio simulations of low-k and ultra low-k dielectric interconnects
by: Tan, V.B.C., et al.
Published: (2014)

Surface processing of nanoporous low dielectric constant thin films
by: LIU JUN
Published: (2010)

Characterization and structural modification of polysilsesquioxanes for low dielectric constant (k) applications in deep sub-micron devices
by: Siew, Yong Kong.
Published: (2008)

Study of a simple method for dielectric constant characterization of microwave substrates
by: Lan, Ying
Published: (2017)

Dielectric failure mechanisms in advanced Cu/low-k interconnect architecture
by: Tan, Tam Lyn
Published: (2008)

Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
by: Lim, Boon Kiat.
Published: (2008)

Modeling and characterization of high dielectric constant tunnel barriers for nanoelectronic applications
by: KOH BIH HIAN
Published: (2010)

High dielectric constant materials in SONOS-type non- volatile memory structures
by: TAN YAN NY
Published: (2010)

Low dielectric constant a-SiOC:H films as copper diffusion barrier
by: Koh, Y.W., et al.
Published: (2014)

Design and architecture of low-dielectric-constant organic-inorganic hybrids from octahydridosilsesquioxanes
by: Yang, B.-H., et al.
Published: (2014)

Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication
by: Kim, Jae Hyung.
Published: (2008)

Pore sealing by NH3 plasma treatment of porous low dielectric constant films
by: Peng, H.-G., et al.
Published: (2014)

Characterization of material constants based on synthetic biaxial data
by: Roongrote Wangkiet, et al.
Published: (2018)

Time dependent dielectric breakdown in copper low-k interconnects : mechanisms and reliability models
by: Wong, Terence Kin Shun
Published: (2013)

Dielectric/metal diffusion barrier in Cu/porous ultra low-k interconnect technology
by: Chen, Zhe
Published: (2008)

Preparation of fluorinated polyemide/POSS nanocomposites with ultra-low dielectric constant by graft copolymerization
by: Chen, Y., et al.
Published: (2014)

Variable-rate coding with constant BER for NOMA via multilevel IRA coding
by: Chi, Yuhao, et al.
Published: (2020)

A novel interconnect material for SOFCs
by: Liu, Z., et al.
Published: (2014)

Synthesis and characterization of stiffness-critical materials using interconnected wires as reinforcement
by: Ganesh, V.V., et al.
Published: (2014)

First-principles study on the concentrations of native point defects in high-dielectric-constant binary oxide materials
by: Zheng, J.X., et al.
Published: (2014)