Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via

• Main Authors: Lin, Ye, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2020
• Subjects: Engineering::Electrical and electronic engineering; Capacitance Density; Integrated Capacitors
• Online Access: https://hdl.handle.net/10356/140157
• Institution: Nanyang Technological University

A new approach to implement integrated capacitors with an excellent capacitance density, called the “3-D embedded capacitor,” is investigated. It is realized by embedding metal-insulator-metal (MIM) layers onto the trenches of through-silicon vias prior to copper filling. An ultrahigh capacitance de...