Flip chip joint-in-via architecture on flexible substrates with Au-Sn interdiffusion bonding
A new joint-in-via architecture has been developed with an instantaneous fluxless bonding know as SLICF (solid-liquid interdiffusion bonding by compressive force) for fine pitch microelectronic packaging. The SLICF bonding utilises a mechanical force to break the Sn oxide layer and allows the submer...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Theses and Dissertations |
| 出版: |
2008
|
| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/5272 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|