Interfacial reaction between Sn-rich solders and Ni-based metallization

Interfacial reaction between Sn-rich solders and Ni-based metallization

Solid state reaction between Sn-rich solders (Sn–3.5Ag and Sn–37Pb) and two types of Ni-based metallization (electroless Ni–P and sputtered Ni) has been studied. The growth rates of the main intermetallic compound (IMC), Ni3Sn4, at different aging temperatures are obtained and the activation energy...

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書目詳細資料
Main Authors:	Kumar, A., Yeo, P. T., He, Min, Qi, Guojun, Chen, Zhong
其他作者:	School of Materials Science & Engineering
格式:	Article
語言:	English
出版:	2012
主題:	DRNTU::Engineering::Materials
在線閱讀:	https://hdl.handle.net/10356/94701 http://hdl.handle.net/10220/8149
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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