In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching

In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching

10.1116/1.1431961

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書目詳細資料
Main Authors:	Kok, K.W., Yoo, W.J., Sooriakumar, K.
其他作者:	ELECTRICAL & COMPUTER ENGINEERING
格式:	Conference or Workshop Item
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/70574
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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