Sims depth profiling analysis of Cu/Ta/SiO2 interfacial diffusion at different annealing temperature
International Journal of Modern Physics B
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Main Authors: | Liu, L., Gong, H., Wang, Y., Wee, A.T.S., Liu, R. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84185 |
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Institution: | National University of Singapore |
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